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Moisture Sensitivity, Reflow Soldering and Washing Information
IXYS has characterized the moisture reflow sensitivity of the film laminated SolarMD using IPC/JEDEC standard J-STD-020. The film
laminated SolarMD meets the standard MSL level 1 soak requirements of 85 ° C/85%RH for 168hrs. Moisture uptake from atmospheric
humidity occurs by diffusion. During the soldering process to the electrode, the combination of moisture uptake and high temperature
soldering may lead to moisture induced delamination and cracking of the component. To prevent this, this component must be handled
with care in soldering. The film laminated SolarMD is not recommended for high temperature surface mount soldering reflow.
SLMD121H04L is encapsulated by the lamination with EVA and polymer film and thus excessively high temperatures soldering reflow
is prohibited. SLMD121H04L is recommended to solder terminals by using oven curable solder paste, for instance, LORD PC10678HV
silver conductor or paste designed for screen print application and curable in convection oven at the profile of 100 ° C for 30 minutes or
150 ° C for 15 minutes. Manual soldering is also recommended with under 260 ° C for 2 sec. IXYS does not recommend the use of
chlorinated solvents for washing.
IXYS reserves the right to change limits, test conditions and dimensions
? 2010 IXYS All rights reserved
IXYS KOREA LTD.
906-5 Iui-dong, Yeongtong-Gu, Suwon, Gyeonggi-Do (Korea)
Phone +82-31-888-5232, Fax +82-31-888-5233
3
Rev. Mar. 2012
IXYS Corporation
1590 Buckeye Drive, Milpitas, CA 95035-7418
Phone (408) 457-9000, Fax 408-496-0670
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